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世界の電子回路基板レベルアンダーフィル材料市場 2021:企業別、地域別、種類・用途別

• 英文タイトル:Global Electronic Circuit Board Level Underfill Material Market 2021 by Manufacturers, Regions, Type and Application, Forecast to 2026

GlobalInfoResearchが調査・発行した産業分析レポートです。世界の電子回路基板レベルアンダーフィル材料市場 2021:企業別、地域別、種類・用途別 / Global Electronic Circuit Board Level Underfill Material Market 2021 by Manufacturers, Regions, Type and Application, Forecast to 2026 / GIR-107A02103資料のイメージです。• レポートコード:GIR-107A02103
• 出版社/出版日:GlobalInfoResearch / 2021年7月
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• レポート形態:英文、PDF、103ページ
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レポート概要
当調査資料では、電子回路基板レベルアンダーフィル材料のグローバル市場について調査・分析し、2021年から2026年までの市場予測をまとめております。電子回路基板レベルアンダーフィル材料の種類別市場規模(クォーツ/シリコーン、アルミナベース、エポキシベース、ウレタンベース、アクリルベース、その他)、用途別市場規模(CSP(チップスケールパッケージ)、BGA(ボールグリッドアレイ)、フリップチップ)、地域別市場規模(北米、アメリカ、ヨーロッパ、アジア、中国、日本、東南アジア、南米、中東、アフリカなど)、市場動向、企業別販売量と市場シェア、販売チャネルなどの情報を掲載しています。
・電子回路基板レベルアンダーフィル材料の市場概要
・企業情報(企業概要、製品概要、販売量、価格、売上):Henkel、Namics、AI Technology、Protavic、H.B. Fuller、ASE、Hitachi、Indium、Zymet、YINCAE、LORD、Sanyu Rec、Dow
・企業別市場シェア
・地域別市場分析2016年-2026年
・種類別分析2016年-2026年:クォーツ/シリコーン、アルミナベース、エポキシベース、ウレタンベース、アクリルベース、その他
・用途別分析2016年-2026年:CSP(チップスケールパッケージ)、BGA(ボールグリッドアレイ)、フリップチップ
・電子回路基板レベルアンダーフィル材料の北米市場規模2016年-2026年:アメリカ、カナダ、メキシコ
・電子回路基板レベルアンダーフィル材料のヨーロッパ市場規模2016年-2026年:ドイツ、イギリス、フランス、ロシア、イタリア
・電子回路基板レベルアンダーフィル材料のアジア市場規模2016年-2026年:中国、日本、韓国、インド、東南アジア、オーストラリア
・電子回路基板レベルアンダーフィル材料の南米市場規模2016年-2026年:ブラジル、アルゼンチン
・電子回路基板レベルアンダーフィル材料の中東・アフリカ市場規模2016年-2026年:サウジアラビア、トルコ、エジプト、南アフリカ
・販売チャネル、流通業者・代理店、顧客リスト
・調査の結果・結論

The Electronic Circuit Board Level Underfill Material market report provides a detailed analysis of global market size, regional and country-level market size, segmentation market growth, market share, competitive Landscape, sales analysis, impact of domestic and global market players, value chain optimization, trade regulations, recent developments, opportunities analysis, strategic market growth analysis, product launches, area marketplace expanding, and technological innovations.

According to our latest research, the global Electronic Circuit Board Level Underfill Material size is estimated to be xx million in 2021 from USD xx million in 2020, with a change of XX% between 2020 and 2021. The global Electronic Circuit Board Level Underfill Material market size is expected to grow at a CAGR of xx% for the next five years.

Market segmentation
Electronic Circuit Board Level Underfill Material market is split by Type and by Application. For the period 2016-2026, the growth among segments provide accurate calculations and forecasts for sales by Type and by Application in terms of volume and value. This analysis can help you expand your business by targeting qualified niche markets.

Market segment by Type, covers
Quartz/Silicone
Alumina Based
Epoxy Based
Urethane Based
Acrylic Based
Others

Market segment by Application can be divided into
CSP (Chip Scale Package)
BGA (Ball Grid array)
Flip Chips

The key market players for global Electronic Circuit Board Level Underfill Material market are listed below:
Henkel
Namics
AI Technology
Protavic
H.B. Fuller
ASE
Hitachi
Indium
Zymet
YINCAE
LORD
Sanyu Rec
Dow

Market segment by Region, regional analysis covers
North America (United States, Canada and Mexico)
Europe (Germany, France, United Kingdom, Russia, Italy, and Rest of Europe)
Asia-Pacific (China, Japan, Korea, India, Southeast Asia, and Australia)
South America (Brazil, Argentina, Colombia, and Rest of South America)
Middle East & Africa (Saudi Arabia, UAE, Egypt, South Africa, and Rest of Middle East & Africa)

The content of the study subjects, includes a total of 14 chapters:
Chapter 1, to describe Electronic Circuit Board Level Underfill Material product scope, market overview, market opportunities, market driving force and market risks.
Chapter 2, to profile the top manufacturers of Electronic Circuit Board Level Underfill Material, with price, sales, revenue and global market share of Electronic Circuit Board Level Underfill Material from 2019 to 2021.
Chapter 3, the Electronic Circuit Board Level Underfill Material competitive situation, sales, revenue and global market share of top manufacturers are analyzed emphatically by landscape contrast.
Chapter 4, the Electronic Circuit Board Level Underfill Material breakdown data are shown at the regional level, to show the sales, revenue and growth by regions, from 2016 to 2026.
Chapter 5 and 6, to segment the sales by type and application, with sales market share and growth rate by type, application, from 2016 to 2026.
Chapter 7, 8, 9, 10 and 11, to break the sales data at the country level, with sales, revenue and market share for key countries in the world, from 2016 to 2021.and Electronic Circuit Board Level Underfill Material market forecast, by regions, type and application, with sales and revenue, from 2021 to 2026.
Chapter 12, 13 and 14, to describe Electronic Circuit Board Level Underfill Material sales channel, distributors, customers, research findings and conclusion, appendix and data source.

レポート目次

1 Market Overview
1.1 Electronic Circuit Board Level Underfill Material Introduction
1.2 Market Analysis by Type
1.2.1 Overview: Global Electronic Circuit Board Level Underfill Material Revenue by Type: 2019 Versus 2021 Versus 2026
1.2.2 Quartz/Silicone
1.2.3 Alumina Based
1.2.4 Epoxy Based
1.2.5 Urethane Based
1.2.6 Acrylic Based
1.2.7 Others
1.3 Market Analysis by Application
1.3.1 Overview: Global Electronic Circuit Board Level Underfill Material Revenue by Application: 2019 Versus 2021 Versus 2026
1.3.2 CSP (Chip Scale Package)
1.3.3 BGA (Ball Grid array)
1.3.4 Flip Chips
1.4 Global Electronic Circuit Board Level Underfill Material Market Size & Forecast
1.4.1 Global Electronic Circuit Board Level Underfill Material Sales in Value (2016-2026))
1.4.2 Global Electronic Circuit Board Level Underfill Material Sales in Volume (2016-2026)
1.4.3 Global Electronic Circuit Board Level Underfill Material Price by Type (2016-2026) & (USD/MT)
1.5 Global Electronic Circuit Board Level Underfill Material Production Capacity Analysis
1.5.1 Global Electronic Circuit Board Level Underfill Material Total Production Capacity (2016-2026)
1.5.2 Global Electronic Circuit Board Level Underfill Material Production Capacity by Geographic Region
1.6 Market Drivers, Restraints and Trends
1.6.1 Electronic Circuit Board Level Underfill Material Market Drivers
1.6.2 Electronic Circuit Board Level Underfill Material Market Restraints
1.6.3 Electronic Circuit Board Level Underfill Material Trends Analysis
2 Manufacturers Profiles
2.1 Henkel
2.1.1 Henkel Details
2.1.2 Henkel Major Business
2.1.3 Henkel Electronic Circuit Board Level Underfill Material Product and Services
2.1.4 Henkel Electronic Circuit Board Level Underfill Material Sales, Price, Revenue, Gross Margin and Market Share (2019-2021)
2.2 Namics
2.2.1 Namics Details
2.2.2 Namics Major Business
2.2.3 Namics Electronic Circuit Board Level Underfill Material Product and Services
2.2.4 Namics Electronic Circuit Board Level Underfill Material Sales, Price, Revenue, Gross Margin and Market Share (2019-2021)
2.3 AI Technology
2.3.1 AI Technology Details
2.3.2 AI Technology Major Business
2.3.3 AI Technology Electronic Circuit Board Level Underfill Material Product and Services
2.3.4 AI Technology Electronic Circuit Board Level Underfill Material Sales, Price, Revenue, Gross Margin and Market Share (2019-2021)
2.4 Protavic
2.4.1 Protavic Details
2.4.2 Protavic Major Business
2.4.3 Protavic Electronic Circuit Board Level Underfill Material Product and Services
2.4.4 Protavic Electronic Circuit Board Level Underfill Material Sales, Price, Revenue, Gross Margin and Market Share (2019-2021)
2.5 H.B. Fuller
2.5.1 H.B. Fuller Details
2.5.2 H.B. Fuller Major Business
2.5.3 H.B. Fuller Electronic Circuit Board Level Underfill Material Product and Services
2.5.4 H.B. Fuller Electronic Circuit Board Level Underfill Material Sales, Price, Revenue, Gross Margin and Market Share (2019-2021)
2.6 ASE
2.6.1 ASE Details
2.6.2 ASE Major Business
2.6.3 ASE Electronic Circuit Board Level Underfill Material Product and Services
2.6.4 ASE Electronic Circuit Board Level Underfill Material Sales, Price, Revenue, Gross Margin and Market Share (2019-2021)
2.7 Hitachi
2.7.1 Hitachi Details
2.7.2 Hitachi Major Business
2.7.3 Hitachi Electronic Circuit Board Level Underfill Material Product and Services
2.7.4 Hitachi Electronic Circuit Board Level Underfill Material Sales, Price, Revenue, Gross Margin and Market Share (2019-2021)
2.8 Indium
2.8.1 Indium Details
2.8.2 Indium Major Business
2.8.3 Indium Electronic Circuit Board Level Underfill Material Product and Services
2.8.4 Indium Electronic Circuit Board Level Underfill Material Sales, Price, Revenue, Gross Margin and Market Share (2019-2021)
2.9 Zymet
2.9.1 Zymet Details
2.9.2 Zymet Major Business
2.9.3 Zymet Electronic Circuit Board Level Underfill Material Product and Services
2.9.4 Zymet Electronic Circuit Board Level Underfill Material Sales, Price, Revenue, Gross Margin and Market Share (2019-2021)
2.10 YINCAE
2.10.1 YINCAE Details
2.10.2 YINCAE Major Business
2.10.3 YINCAE Electronic Circuit Board Level Underfill Material Product and Services
2.10.4 YINCAE Electronic Circuit Board Level Underfill Material Sales, Price, Revenue, Gross Margin and Market Share (2019-2021)
2.11 LORD
2.11.1 LORD Details
2.11.2 LORD Major Business
2.11.3 LORD Electronic Circuit Board Level Underfill Material Product and Services
2.11.4 LORD Electronic Circuit Board Level Underfill Material Sales, Price, Revenue, Gross Margin and Market Share (2019-2021)
2.12 Sanyu Rec
2.12.1 Sanyu Rec Details
2.12.2 Sanyu Rec Major Business
2.12.3 Sanyu Rec Electronic Circuit Board Level Underfill Material Product and Services
2.12.4 Sanyu Rec Electronic Circuit Board Level Underfill Material Sales, Price, Revenue, Gross Margin and Market Share (2019-2021)
2.13 Dow
2.13.1 Dow Details
2.13.2 Dow Major Business
2.13.3 Dow Electronic Circuit Board Level Underfill Material Product and Services
2.13.4 Dow Electronic Circuit Board Level Underfill Material Sales, Price, Revenue, Gross Margin and Market Share (2019-2021)
3 Electronic Circuit Board Level Underfill Material Sales by Manufacturer
3.1 Global Electronic Circuit Board Level Underfill Material Sales in Volume by Manufacturer (2019-2021e)
3.2 Global Electronic Circuit Board Level Underfill Material Revenue by Manufacturer (2019-2021e)
3.3 Key Manufacturer Market Position in Electronic Circuit Board Level Underfill Material
3.4 Market Concentration Rate
3.4.1 Top 3 Electronic Circuit Board Level Underfill Material Manufacturer Market Share
3.4.2 Top 6 Electronic Circuit Board Level Underfill Material Manufacturer Market Share
3.5 Global Electronic Circuit Board Level Underfill Material Production Capacity by Company
3.6 Manufacturer by Geography: Head Office and Electronic Circuit Board Level Underfill Material Production Site
3.7 New Entrant and Capacity Expansion Plans
3.8 Mergers & Acquisitions
4 Market Analysis by Region
4.1 Global Electronic Circuit Board Level Underfill Material Market Size by Region
4.1.1 Global Electronic Circuit Board Level Underfill Material Sales in Volume by Region (2016-2026)
4.1.2 Global Electronic Circuit Board Level Underfill Material Revenue by Region (2016-2026)
4.2 North America Electronic Circuit Board Level Underfill Material Revenue (2016-2026)
4.3 Europe Electronic Circuit Board Level Underfill Material Revenue (2016-2026)
4.4 Asia-Pacific Electronic Circuit Board Level Underfill Material Revenue (2016-2026)
4.5 South America Electronic Circuit Board Level Underfill Material Revenue (2016-2026)
4.6 Middle East and Africa Electronic Circuit Board Level Underfill Material Revenue (2016-2026)
5 Market Segment by Type
5.1 Global Electronic Circuit Board Level Underfill Material Sales in Volume by Type (2016-2026)
5.2 Global Electronic Circuit Board Level Underfill Material Revenue by Type (2016-2026)
5.3 Global Electronic Circuit Board Level Underfill Material Price by Type (2016-2026)
6 Market Segment by Application
6.1 Global Electronic Circuit Board Level Underfill Material Sales in Volume by Application (2016-2026)
6.2 Global Electronic Circuit Board Level Underfill Material Revenue by Application (2016-2026)
6.3 Global Electronic Circuit Board Level Underfill Material Price by Application (2016-2026)
7 North America by Country, by Type, and by Application
7.1 North America Electronic Circuit Board Level Underfill Material Sales by Type (2016-2026)
7.2 North America Electronic Circuit Board Level Underfill Material Sales by Application (2016-2026)
7.3 North America Electronic Circuit Board Level Underfill Material Market Size by Country
7.3.1 North America Electronic Circuit Board Level Underfill Material Sales in Volume by Country (2016-2026)
7.3.2 North America Electronic Circuit Board Level Underfill Material Revenue by Country (2016-2026)
7.3.3 United States Market Size and Forecast (2016-2026)
7.3.4 Canada Market Size and Forecast (2016-2026)
7.3.5 Mexico Market Size and Forecast (2016-2026)
8 Europe by Country, by Type, and by Application
8.1 Europe Electronic Circuit Board Level Underfill Material Sales by Type (2016-2026)
8.2 Europe Electronic Circuit Board Level Underfill Material Sales by Application (2016-2026)
8.3 Europe Electronic Circuit Board Level Underfill Material Market Size by Country
8.3.1 Europe Electronic Circuit Board Level Underfill Material Sales in Volume by Country (2016-2026)
8.3.2 Europe Electronic Circuit Board Level Underfill Material Revenue by Country (2016-2026)
8.3.3 Germany Market Size and Forecast (2016-2026)
8.3.4 France Market Size and Forecast (2016-2026)
8.3.5 United Kingdom Market Size and Forecast (2016-2026)
8.3.6 Russia Market Size and Forecast (2016-2026)
8.3.7 Italy Market Size and Forecast (2016-2026)
9 Asia-Pacific by Country, by Type, and by Application
9.1 Asia-Pacific Electronic Circuit Board Level Underfill Material Sales by Type (2016-2026)
9.2 Asia-Pacific Electronic Circuit Board Level Underfill Material Sales by Application (2016-2026)
9.3 Asia-Pacific Electronic Circuit Board Level Underfill Material Market Size by Region
9.3.1 Asia-Pacific Electronic Circuit Board Level Underfill Material Sales in Volume by Region (2016-2026)
9.3.2 Asia-Pacific Electronic Circuit Board Level Underfill Material Revenue by Region (2016-2026)
9.3.3 China Market Size and Forecast (2016-2026)
9.3.4 Japan Market Size and Forecast (2016-2026)
9.3.5 Korea Market Size and Forecast (2016-2026)
9.3.6 India Market Size and Forecast (2016-2026)
9.3.7 Southeast Asia Market Size and Forecast (2016-2026)
9.3.8 Australia Market Size and Forecast (2016-2026)
10 South America by Country, by Type, and by Application
10.1 South America Electronic Circuit Board Level Underfill Material Sales by Type (2016-2026)
10.2 South America Electronic Circuit Board Level Underfill Material Sales by Application (2016-2026)
10.3 South America Electronic Circuit Board Level Underfill Material Market Size by Country
10.3.1 South America Electronic Circuit Board Level Underfill Material Sales in Volume by Country (2016-2026)
10.3.2 South America Electronic Circuit Board Level Underfill Material Revenue by Country (2016-2026)
10.3.3 Brazil Market Size and Forecast (2016-2026)
10.3.4 Argentina Market Size and Forecast (2016-2026)
11 Middle East & Africa by Country, by Type, and by Application
11.1 Middle East & Africa Electronic Circuit Board Level Underfill Material Sales by Type (2016-2026)
11.2 Middle East & Africa Electronic Circuit Board Level Underfill Material Sales by Application (2016-2026)
11.3 Middle East & Africa Electronic Circuit Board Level Underfill Material Market Size by Country
11.3.1 Middle East & Africa Electronic Circuit Board Level Underfill Material Sales in Volume by Country (2016-2026)
11.3.2 Middle East & Africa Electronic Circuit Board Level Underfill Material Revenue by Country (2016-2026)
11.3.3 Turkey Market Size and Forecast (2016-2026)
11.3.4 Egypt Market Size and Forecast (2016-2026)
11.3.5 Saudi Arabia Market Size and Forecast (2016-2026)
11.3.6 South Africa Market Size and Forecast (2016-2026)
12 Sales Channel, Distributors, Traders and Dealers
12.1 Sales Channel
12.1.1 Direct Marketing
12.1.2 Indirect Marketing
12.2 Electronic Circuit Board Level Underfill Material Typical Distributors
12.3 Electronic Circuit Board Level Underfill Material Typical Customers
13 Research Findings and Conclusion
14 Appendix
14.1 Methodology
14.2 Research Process and Data Source
14.3 Disclaimer

List of Tables
Table 1. Global Electronic Circuit Board Level Underfill Material Revenue by Type, (USD Million), 2021-2026
Table 2. Global Electronic Circuit Board Level Underfill Material Revenue by Application, (USD Million), 2021-2026
Table 3. Henkel Basic Information, Manufacturing Base and Competitors
Table 4. Henkel Major Business
Table 5. Henkel Electronic Circuit Board Level Underfill Material Product and Services
Table 6. Henkel Electronic Circuit Board Level Underfill Material Sales (K MT), Price (USD/MT), Revenue (USD Million), Gross Margin and Market Share (2019-2021e)
Table 7. Namics Basic Information, Manufacturing Base and Competitors
Table 8. Namics Major Business
Table 9. Namics Electronic Circuit Board Level Underfill Material Product and Services
Table 10. Namics Electronic Circuit Board Level Underfill Material Sales (K MT), Price (USD/MT), Revenue (USD Million), Gross Margin and Market Share (2019-2021e)
Table 11. AI Technology Basic Information, Manufacturing Base and Competitors
Table 12. AI Technology Major Business
Table 13. AI Technology Electronic Circuit Board Level Underfill Material Product and Services
Table 14. AI Technology Electronic Circuit Board Level Underfill Material Sales (K MT), Price (USD/MT), Revenue (USD Million), Gross Margin and Market Share (2019-2021e)
Table 15. Protavic Basic Information, Manufacturing Base and Competitors
Table 16. Protavic Major Business
Table 17. Protavic Electronic Circuit Board Level Underfill Material Product and Services
Table 18. Protavic Electronic Circuit Board Level Underfill Material Sales (K MT), Price (USD/MT), Revenue (USD Million), Gross Margin and Market Share (2019-2021e)
Table 19. H.B. Fuller Basic Information, Manufacturing Base and Competitors
Table 20. H.B. Fuller Major Business
Table 21. H.B. Fuller Electronic Circuit Board Level Underfill Material Product and Services
Table 22. H.B. Fuller Electronic Circuit Board Level Underfill Material Sales (K MT), Price (USD/MT), Revenue (USD Million), Gross Margin and Market Share (2019-2021e)
Table 23. ASE Basic Information, Manufacturing Base and Competitors
Table 24. ASE Major Business
Table 25. ASE Electronic Circuit Board Level Underfill Material Product and Services
Table 26. ASE Electronic Circuit Board Level Underfill Material Sales (K MT), Price (USD/MT), Revenue (USD Million), Gross Margin and Market Share (2019-2021e)
Table 27. Hitachi Basic Information, Manufacturing Base and Competitors
Table 28. Hitachi Major Business
Table 29. Hitachi Electronic Circuit Board Level Underfill Material Product and Services
Table 30. Hitachi Electronic Circuit Board Level Underfill Material Sales (K MT), Price (USD/MT), Revenue (USD Million), Gross Margin and Market Share (2019-2021e)
Table 31. Indium Basic Information, Manufacturing Base and Competitors
Table 32. Indium Major Business
Table 33. Indium Electronic Circuit Board Level Underfill Material Product and Services
Table 34. Indium Electronic Circuit Board Level Underfill Material Sales (K MT), Price (USD/MT), Revenue (USD Million), Gross Margin and Market Share (2019-2021e)
Table 35. Zymet Basic Information, Manufacturing Base and Competitors
Table 36. Zymet Major Business
Table 37. Zymet Electronic Circuit Board Level Underfill Material Product and Services
Table 38. Zymet Electronic Circuit Board Level Underfill Material Sales (K MT), Price (USD/MT), Revenue (USD Million), Gross Margin and Market Share (2019-2021e)
Table 39. YINCAE Basic Information, Manufacturing Base and Competitors
Table 40. YINCAE Major Business
Table 41. YINCAE Electronic Circuit Board Level Underfill Material Product and Services
Table 42. YINCAE Electronic Circuit Board Level Underfill Material Sales (K MT), Price (USD/MT), Revenue (USD Million), Gross Margin and Market Share (2019-2021e)
Table 43. LORD Basic Information, Manufacturing Base and Competitors
Table 44. LORD Major Business
Table 45. LORD Electronic Circuit Board Level Underfill Material Product and Services
Table 46. LORD Electronic Circuit Board Level Underfill Material Sales (K MT), Price (USD/MT), Revenue (USD Million), Gross Margin and Market Share (2019-2021e)
Table 47. Sanyu Rec Basic Information, Manufacturing Base and Competitors
Table 48. Sanyu Rec Major Business
Table 49. Sanyu Rec Electronic Circuit Board Level Underfill Material Product and Services
Table 50. Sanyu Rec Electronic Circuit Board Level Underfill Material Sales (K MT), Price (USD/MT), Revenue (USD Million), Gross Margin and Market Share (2019-2021e)
Table 51. Dow Basic Information, Manufacturing Base and Competitors
Table 52. Dow Major Business
Table 53. Dow Electronic Circuit Board Level Underfill Material Product and Services
Table 54. Dow Electronic Circuit Board Level Underfill Material Sales (K MT), Price (USD/MT), Revenue (USD Million), Gross Margin and Market Share (2019-2021e)
Table 55. Global Electronic Circuit Board Level Underfill Material Sales by Manufacturer (2019-2021e) & (K MT)
Table 56. Global Electronic Circuit Board Level Underfill Material Revenue by Manufacturer (2019-2021e) & (USD Million)
Table 57. Market Position of Manufacturers in Electronic Circuit Board Level Underfill Material, (Tier 1, Tier 2, and Tier 3), Based on Revenue in 2020
Table 58. Global Electronic Circuit Board Level Underfill Material Production Capacity by Company, (K MT): 2020 VS 2021
Table 59. Head Office and Electronic Circuit Board Level Underfill Material Production Site of Key Manufacturer
Table 60. Electronic Circuit Board Level Underfill Material New Entrant and Capacity Expansion Plans
Table 61. Electronic Circuit Board Level Underfill Material Mergers & Acquisitions in the Past Five Years
Table 62. Global Electronic Circuit Board Level Underfill Material Sales by Region (2016-2021e) & (K MT)
Table 63. Global Electronic Circuit Board Level Underfill Material Sales by Region (2021-2026) & (K MT)
Table 64. Global Electronic Circuit Board Level Underfill Material Revenue by Region (2016-2021e) & (USD Million)
Table 65. Global Electronic Circuit Board Level Underfill Material Revenue by Region (2021-2026) & (USD Million)
Table 66. Global Electronic Circuit Board Level Underfill Material Sales by Type (2016-2021e) & (K MT)
Table 67. Global Electronic Circuit Board Level Underfill Material Sales by Type (2021-2026) & (K MT)
Table 68. Global Electronic Circuit Board Level Underfill Material Revenue by Type (2016-2021e) & (USD Million)
Table 69. Global Electronic Circuit Board Level Underfill Material Revenue by Type (2021-2026) & (USD Million)
Table 70. Global Electronic Circuit Board Level Underfill Material Price by Type (2016-2021e) & (USD/MT)
Table 71. Global Electronic Circuit Board Level Underfill Material Price by Type (2021-2026) & (USD/MT)
Table 72. Global Electronic Circuit Board Level Underfill Material Sales by Application (2016-2021e) & (K MT)
Table 73. Global Electronic Circuit Board Level Underfill Material Sales by Application (2021-2026) & (K MT)
Table 74. Global Electronic Circuit Board Level Underfill Material Revenue by Application (2016-2021e) & (USD Million)
Table 75. Global Electronic Circuit Board Level Underfill Material Revenue by Application (2021-2026) & (USD Million)
Table 76. Global Electronic Circuit Board Level Underfill Material Price by Application (2016-2021e) & (USD/MT)
Table 77. Global Electronic Circuit Board Level Underfill Material Price by Application (2021-2026) & (USD/MT)
Table 78. North America Electronic Circuit Board Level Underfill Material Sales by Country (2016-2021e) & (K MT)
Table 79. North America Electronic Circuit Board Level Underfill Material Sales by Country (2021-2026) & (K MT)
Table 80. North America Electronic Circuit Board Level Underfill Material Revenue by Country (2016-2021e) & (USD Million)
Table 81. North America Electronic Circuit Board Level Underfill Material Revenue by Country (2021-2026) & (USD Million)
Table 82. North America Electronic Circuit Board Level Underfill Material Sales by Type (2016-2021e) & (K MT)
Table 83. North America Electronic Circuit Board Level Underfill Material Sales by Type (2021-2026) & (K MT)
Table 84. North America Electronic Circuit Board Level Underfill Material Sales by Application (2016-2021e) & (K MT)
Table 85. North America Electronic Circuit Board Level Underfill Material Sales by Application (2021-2026) & (K MT)
Table 86. Europe Electronic Circuit Board Level Underfill Material Sales by Country (2016-2021e) & (K MT)
Table 87. Europe Electronic Circuit Board Level Underfill Material Sales by Country (2021-2026) & (K MT)
Table 88. Europe Electronic Circuit Board Level Underfill Material Revenue by Country (2016-2021e) & (USD Million)
Table 89. Europe Electronic Circuit Board Level Underfill Material Revenue by Country (2021-2026) & (USD Million)
Table 90. Europe Electronic Circuit Board Level Underfill Material Sales by Type (2016-2021e) & (K MT)
Table 91. Europe Electronic Circuit Board Level Underfill Material Sales by Type (2021-2026) & (K MT)
Table 92. Europe Electronic Circuit Board Level Underfill Material Sales by Application (2016-2021e) & (K MT)
Table 93. Europe Electronic Circuit Board Level Underfill Material Sales by Application (2021-2026) & (K MT)
Table 94. Asia-Pacific Electronic Circuit Board Level Underfill Material Sales by Region (2016-2021e) & (K MT)
Table 95. Asia-Pacific Electronic Circuit Board Level Underfill Material Sales by Region (2021-2026) & (K MT)
Table 96. Asia-Pacific Electronic Circuit Board Level Underfill Material Revenue by Region (2016-2021e) & (USD Million)
Table 97. Asia-Pacific Electronic Circuit Board Level Underfill Material Revenue by Region (2021-2026) & (USD Million)
Table 98. Asia-Pacific Electronic Circuit Board Level Underfill Material Sales by Type (2016-2021e) & (K MT)
Table 99. Asia-Pacific Electronic Circuit Board Level Underfill Material Sales by Type (2021-2026) & (K MT)
Table 100. Asia-Pacific Electronic Circuit Board Level Underfill Material Sales by Application (2016-2021e) & (K MT)
Table 101. Asia-Pacific Electronic Circuit Board Level Underfill Material Sales by Application (2021-2026) & (K MT)
Table 102. South America Electronic Circuit Board Level Underfill Material Sales by Country (2016-2021e) & (K MT)
Table 103. South America Electronic Circuit Board Level Underfill Material Sales by Country (2021-2026) & (K MT)
Table 104. South America Electronic Circuit Board Level Underfill Material Revenue by Country (2016-2021e) & (USD Million)
Table 105. South America Electronic Circuit Board Level Underfill Material Revenue by Country (2021-2026) & (USD Million)
Table 106. South America Electronic Circuit Board Level Underfill Material Sales by Type (2016-2021e) & (K MT)
Table 107. South America Electronic Circuit Board Level Underfill Material Sales by Type (2021-2026) & (K MT)
Table 108. South America Electronic Circuit Board Level Underfill Material Sales by Application (2016-2021e) & (K MT)
Table 109. South America Electronic Circuit Board Level Underfill Material Sales by Application (2021-2026) & (K MT)
Table 110. Middle East & Africa Electronic Circuit Board Level Underfill Material Sales by Country (2016-2021e) & (K MT)
Table 111. Middle East & Africa Electronic Circuit Board Level Underfill Material Sales by Country (2021-2026) & (K MT)
Table 112. Middle East & Africa Electronic Circuit Board Level Underfill Material Revenue by Country (2016-2021e) & (USD Million)
Table 113. Middle East & Africa Electronic Circuit Board Level Underfill Material Revenue by Country (2021-2026) & (USD Million)
Table 114. Middle East & Africa Electronic Circuit Board Level Underfill Material Sales by Type (2016-2021e) & (K MT)
Table 115. Middle East & Africa Electronic Circuit Board Level Underfill Material Sales by Type (2021-2026) & (K MT)
Table 116. Middle East & Africa Electronic Circuit Board Level Underfill Material Sales by Application (2016-2021e) & (K MT)
Table 117. Middle East & Africa Electronic Circuit Board Level Underfill Material Sales by Application (2021-2026) & (K MT)
Table 118. Direct Channel Pros & Cons
Table 119. Indirect Channel Pros & Cons
Table 120. Electronic Circuit Board Level Underfill Material Typical Distributors
Table 121. Electronic Circuit Board Level Underfill Material Typical Customers
List of Figures
Figure 1. Electronic Circuit Board Level Underfill Material Picture
Figure 2. Global Electronic Circuit Board Level Underfill Material Sales Market Share by Type in 2020
Figure 3. Quartz/Silicone
Figure 4. Alumina Based
Figure 5. Epoxy Based
Figure 6. Urethane Based
Figure 7. Acrylic Based
Figure 8. Others
Figure 9. Global Electronic Circuit Board Level Underfill Material Sales Market Share by Application in 2020
Figure 10. CSP (Chip Scale Package)
Figure 11. BGA (Ball Grid array)
Figure 12. Flip Chips
Figure 13. Global Electronic Circuit Board Level Underfill Material Market Size, (USD Million) & (K MT): 2020 VS 2021 VS 2026
Figure 14. Global Electronic Circuit Board Level Underfill Material Market Size and Forecast (2016-2026) & (USD Million)
Figure 15. Global Electronic Circuit Board Level Underfill Material Sales (2016-2026) & (K MT)
Figure 16. Global Electronic Circuit Board Level Underfill Material Price by Type (2016-2026) & (USD/MT)
Figure 17. Global Electronic Circuit Board Level Underfill Material Production Capacity (2016-2026) & (K MT)
Figure 18. Global Electronic Circuit Board Level Underfill Material Production Capacity by Geographic Region: 2020 VS 2021
Figure 19. Electronic Circuit Board Level Underfill Material Market Drivers
Figure 20. Electronic Circuit Board Level Underfill Material Market Restraints
Figure 21. Electronic Circuit Board Level Underfill Material Market Trends
Figure 22. Global Electronic Circuit Board Level Underfill Material Sales Market Share by Manufacturer in 2020
Figure 23. Global Electronic Circuit Board Level Underfill Material Revenue Market Share by Manufacturer in 2020
Figure 24. Electronic Circuit Board Level Underfill Material Market Share by Company Type (Tier 1, Tier 2, and Tier 3)
Figure 25. Top 3 Electronic Circuit Board Level Underfill Material Manufacturer (Revenue) Market Share in 2020
Figure 26. Top 6 Electronic Circuit Board Level Underfill Material Manufacturer (Revenue) Market Share in 2020
Figure 27. Global Electronic Circuit Board Level Underfill Material Sales Market Share by Region (2016-2026)
Figure 28. Global Electronic Circuit Board Level Underfill Material Revenue Market Share by Region (2016-2026)
Figure 29. North America Electronic Circuit Board Level Underfill Material Revenue (2016-2026) & (USD Million)
Figure 30. Europe Electronic Circuit Board Level Underfill Material Revenue (2016-2026) & (USD Million)
Figure 31. Asia-Pacific Electronic Circuit Board Level Underfill Material Revenue (2016-2026) & (USD Million)
Figure 32. South America Electronic Circuit Board Level Underfill Material Revenue (2016-2026) & (USD Million)
Figure 33. Middle East & Africa Electronic Circuit Board Level Underfill Material Revenue (2016-2026) & (USD Million)
Figure 34. Global Electronic Circuit Board Level Underfill Material Sales Market Share by Type (2016-2026)
Figure 35. Global Electronic Circuit Board Level Underfill Material Revenue Market Share by Type (2016-2026)
Figure 36. Global Electronic Circuit Board Level Underfill Material Price by Type (2016-2026) & (USD/MT)
Figure 37. Global Electronic Circuit Board Level Underfill Material Sales Market Share by Application (2016-2026)
Figure 38. Global Electronic Circuit Board Level Underfill Material Revenue Market Share by Application (2016-2026)
Figure 39. Global Electronic Circuit Board Level Underfill Material Price by Application (2016-2026) & (USD/MT)
Figure 40. North America Electronic Circuit Board Level Underfill Material Sales Market Share by Type (2016-2026)
Figure 41. North America Electronic Circuit Board Level Underfill Material Sales Market Share by Application (2016-2026)
Figure 42. North America Electronic Circuit Board Level Underfill Material Sales Market Share by Country (2016-2026)
Figure 43. North America Electronic Circuit Board Level Underfill Material Revenue Market Share by Country (2016-2026)
Figure 44. United States Electronic Circuit Board Level Underfill Material Revenue and Growth Rate (2016-2026) & (USD Million)
Figure 45. Canada Electronic Circuit Board Level Underfill Material Revenue and Growth Rate (2016-2026) & (USD Million)
Figure 46. Mexico Electronic Circuit Board Level Underfill Material Revenue and Growth Rate (2016-2026) & (USD Million)
Figure 47. Europe Electronic Circuit Board Level Underfill Material Sales Market Share by Type (2016-2026)
Figure 48. Europe Electronic Circuit Board Level Underfill Material Sales Market Share by Application (2016-2026)
Figure 49. Europe Electronic Circuit Board Level Underfill Material Sales Market Share by Country (2016-2026)
Figure 50. Europe Electronic Circuit Board Level Underfill Material Revenue Market Share by Country (2016-2026)
Figure 51. Germany Electronic Circuit Board Level Underfill Material Revenue and Growth Rate (2016-2026) & (USD Million)
Figure 52. France Electronic Circuit Board Level Underfill Material Revenue and Growth Rate (2016-2026) & (USD Million)
Figure 53. United Kingdom Electronic Circuit Board Level Underfill Material Revenue and Growth Rate (2016-2026) & (USD Million)
Figure 54. Russia Electronic Circuit Board Level Underfill Material Revenue and Growth Rate (2016-2026) & (USD Million)
Figure 55. Italy Electronic Circuit Board Level Underfill Material Revenue and Growth Rate (2016-2026) & (USD Million)
Figure 56. Asia-Pacific Electronic Circuit Board Level Underfill Material Sales Market Share by Region (2016-2026)
Figure 57. Asia-Pacific Electronic Circuit Board Level Underfill Material Sales Market Share by Application (2016-2026)
Figure 58. Asia-Pacific Electronic Circuit Board Level Underfill Material Sales Market Share by Region (2016-2026)
Figure 59. Asia-Pacific Electronic Circuit Board Level Underfill Material Revenue Market Share by Region (2016-2026)
Figure 60. China Electronic Circuit Board Level Underfill Material Revenue and Growth Rate (2016-2026) & (USD Million)
Figure 61. Japan Electronic Circuit Board Level Underfill Material Revenue and Growth Rate (2016-2026) & (USD Million)
Figure 62. Korea Electronic Circuit Board Level Underfill Material Revenue and Growth Rate (2016-2026) & (USD Million)
Figure 63. India Electronic Circuit Board Level Underfill Material Revenue and Growth Rate (2016-2026) & (USD Million)
Figure 64. Southeast Asia Electronic Circuit Board Level Underfill Material Revenue and Growth Rate (2016-2026) & (USD Million)
Figure 65. Australia Electronic Circuit Board Level Underfill Material Revenue and Growth Rate (2016-2026) & (USD Million)
Figure 66. South America Electronic Circuit Board Level Underfill Material Sales Market Share by Type (2016-2026)
Figure 67. South America Electronic Circuit Board Level Underfill Material Sales Market Share by Application (2016-2026)
Figure 68. South America Electronic Circuit Board Level Underfill Material Sales Market Share by Country (2016-2026)
Figure 69. South America Electronic Circuit Board Level Underfill Material Revenue Market Share by Country (2016-2026)
Figure 70. Brazil Electronic Circuit Board Level Underfill Material Revenue and Growth Rate (2016-2026) & (USD Million)
Figure 71. Argentina Electronic Circuit Board Level Underfill Material Revenue and Growth Rate (2016-2026) & (USD Million)
Figure 72. Middle East & Africa Electronic Circuit Board Level Underfill Material Sales Market Share by Type (2016-2026)
Figure 73. Middle East & Africa Electronic Circuit Board Level Underfill Material Sales Market Share by Application (2016-2026)
Figure 74. Middle East & Africa Electronic Circuit Board Level Underfill Material Sales Market Share by Country (2016-2026)
Figure 75. Middle East & Africa Electronic Circuit Board Level Underfill Material Revenue Market Share by Country (2016-2026)
Figure 76. Turkey Electronic Circuit Board Level Underfill Material Revenue and Growth Rate (2016-2026) & (USD Million)
Figure 77. Egypt Electronic Circuit Board Level Underfill Material Revenue and Growth Rate (2016-2026) & (USD Million)
Figure 78. Saudi Arabia Electronic Circuit Board Level Underfill Material Revenue and Growth Rate (2016-2026) & (USD Million)
Figure 79. South Africa Electronic Circuit Board Level Underfill Material Revenue and Growth Rate (2016-2026) & (USD Million)
Figure 80. Sales Channel: Direct Channel vs Indirect Channel
Figure 81. Methodology
Figure 82. Research Process and Data Source